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MSI PRO B760 WiFi Motherboard for Intel 12th/13th/14th Gen Processors (PCIe 4.0, Wi-Fi 6E, Bluetooth 5.3)
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| Brand: | MSI |
The MSI PRO B760-P WiFi DDR4 ProSeries Motherboard is designed for users seeking a balance of performance and reliability for both gaming and professional tasks. It supports the latest 12th, 13th, and 14th generation Intel Core, Pentium Gold, and Celeron processors with the LGA 1700 socket, ensuring compatibility with a wide range of modern CPUs. The motherboard is built with a robust 6-layer PCB using 2oz thickened copper and server-grade materials for enhanced durability and signal integrity.
This motherboard features an advanced power delivery system with a 12+1 Duet Rail Power System that includes P-PAK components, 8-pin and 4-pin CPU power connectors, and technologies like Core Boost and Memory Boost to ensure stable and efficient power delivery to the CPU and memory. The enhanced thermal solution includes an extended heatsink, MOSFET thermal pads rated for 7W/mK, additional choke thermal pads, and an M.2 Shield Frozr to maintain optimal temperatures during heavy workloads or extended gaming sessions.
The motherboard also supports high-speed DDR4 memory with dual-channel configurations capable of reaching up to 5333+MHz (overclocked). It includes multiple expansion options such as PCIe 4.0 slots for high-speed storage and graphics cards, M.2 slots with thermal solutions for NVMe SSDs, and a variety of connectivity options including USB 3.2 Gen2 ports, HDMI, DisplayPort, a 2.5Gbps LAN port for fast networking, Wi-Fi 6E for high-speed wireless connectivity, and Bluetooth 5.3 for seamless device pairing.
Brand: MSI
Model: PRO B760-P WiFi DDR4
Specifications: Supports 12th/13th/14th Gen Intel Processors (LGA 1700), DDR4 memory up to 5333+MHz (OC), PCIe 4.0 x16 slot, M.2 slots with thermal solution, 2.5Gbps LAN, USB 3.2 Gen2 ports, HDMI/DP outputs
Features: 12+1 Duet Rail Power System with P-PAK, Core Boost and Memory Boost technologies, extended heatsink with MOSFET thermal pads (7W/mK), M.2 Shield Frozr thermal solution, 6-layer PCB with server-grade materials, Wi-Fi 6E and Bluetooth 5.3 support
This motherboard features an advanced power delivery system with a 12+1 Duet Rail Power System that includes P-PAK components, 8-pin and 4-pin CPU power connectors, and technologies like Core Boost and Memory Boost to ensure stable and efficient power delivery to the CPU and memory. The enhanced thermal solution includes an extended heatsink, MOSFET thermal pads rated for 7W/mK, additional choke thermal pads, and an M.2 Shield Frozr to maintain optimal temperatures during heavy workloads or extended gaming sessions.
The motherboard also supports high-speed DDR4 memory with dual-channel configurations capable of reaching up to 5333+MHz (overclocked). It includes multiple expansion options such as PCIe 4.0 slots for high-speed storage and graphics cards, M.2 slots with thermal solutions for NVMe SSDs, and a variety of connectivity options including USB 3.2 Gen2 ports, HDMI, DisplayPort, a 2.5Gbps LAN port for fast networking, Wi-Fi 6E for high-speed wireless connectivity, and Bluetooth 5.3 for seamless device pairing.
Brand: MSI
Model: PRO B760-P WiFi DDR4
Specifications: Supports 12th/13th/14th Gen Intel Processors (LGA 1700), DDR4 memory up to 5333+MHz (OC), PCIe 4.0 x16 slot, M.2 slots with thermal solution, 2.5Gbps LAN, USB 3.2 Gen2 ports, HDMI/DP outputs
Features: 12+1 Duet Rail Power System with P-PAK, Core Boost and Memory Boost technologies, extended heatsink with MOSFET thermal pads (7W/mK), M.2 Shield Frozr thermal solution, 6-layer PCB with server-grade materials, Wi-Fi 6E and Bluetooth 5.3 support
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