The MSI B860M Gaming Plus WiFi motherboard is designed for high-performance gaming and computing, specifically tailored for Intel Core Ultra Processors (Series 2) with the LGA 1851 socket. It features a robust 12 Duet Rail Power System (P-PAK) VRM with Core Boost architecture and Frozr Guard technology to ensure stable and efficient power delivery to the CPU. The motherboard includes advanced cooling solutions such as 7W/mK MOSFET thermal pads, extra choke thermal pads, and an extended heatsink, along with a dedicated chipset heatsink for optimal thermal management.
The board supports DDR5 memory with a maximum overclocking speed of 8800+ MT/s, providing excellent performance for memory-intensive applications and gaming. It includes four DDR5 DIMM slots, allowing for high-capacity and high-speed memory configurations. The PCIe 5.0 x16 slot supports cutting-edge graphics cards with a data transfer rate of up to 128GB/s, enhanced by Steel Armor for durability and stability.
Storage options are extensive, featuring three M.2 slots: one M.2 Gen5 x4 slot with an EZ M.2 Shield Frozr II to prevent thermal throttling, one M.2 Gen4 x4 slot, and one M.2 Gen4 x2 slot. These provide flexibility for high-speed storage solutions.
Connectivity is robust, with full-speed Wi-Fi 7 and Bluetooth 5.4 technology, Intel Killer 5G LAN for low-latency gaming and streaming, Thunderbolt 4 Type-C with display output support, and 7.1 HD Audio with Audio Boost for immersive sound quality. The motherboard also includes a durable server-grade 6-layer PCB and Surface Mount Technology (SMT) solder welding for improved signal clarity and reliability.
The B860M Gaming Plus WiFi is ideal for gamers and power users seeking a motherboard that combines PCIe 5.0 x16 graphics card support, improved DDR5 memory performance, Thunderbolt 4 connectivity, and M.2 Gen5 storage options in a single, elegant design.
Brand: MSI
Model: B860M Gaming Plus WiFi
Specifications: Supports Intel Core Ultra Processors (Series 2), LGA 1851; DDR5 memory up to 8800+ MT/s (OC); PCIe 5.0 x16 slot; Triple M.2 connectors (Gen5 x4, Gen4 x4, Gen4 x2); Wi-Fi 7 with Bluetooth 5.4; Intel Killer 5G LAN; Thunderbolt 4 Type-C; 6-layer PCB with SMT soldering
Features: 12 Duet Rail Power System (P-PAK) VRM with Core Boost architecture; Frozr Guard cooling technology; Extended heatsink and thermal pads; EZ M.2 Shield Frozr II; Audio Boost; Server-grade PCB with SMT soldering
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