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Intel Core i3-12100F Gaming CPU & MSI B760-P WiFi Motherboard
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| Brand: | Intel |
The Intel Core i3-12100F Desktop Processor is a mid-range CPU designed for efficient performance in everyday computing tasks and light gaming. It features 4 cores and 8 threads, with a base clock speed of up to 3.3 GHz and a maximum turbo frequency of 4.3 GHz. The processor is built on Intel's 12th Generation Alder Lake architecture, which combines performance-core (P-core) and efficiency-core (E-core) designs for improved multitasking and power efficiency. It has a TDP of 58W, making it suitable for systems that prioritize energy efficiency without sacrificing performance. The processor is compatible with the LGA 1700 socket and supports 12th and 13th Gen Intel Core, Pentium Gold, and Celeron processors.
The MSI PRO B760-P WiFi DDR4 ProSeries Motherboard is designed to complement the Intel Core i3-12100F processor. It features an LGA 1700 socket, making it compatible with the latest Intel processors. The motherboard supports DDR4 memory with dual-channel support, allowing for faster data transfer rates and improved system performance. It includes a 12+1 duet rail power system with P-PAK technology, ensuring stable power delivery to the CPU for optimal performance. The motherboard also includes features like Core Boost and Memory Boost, which enhance CPU and memory performance respectively.
The motherboard is equipped with a premium thermal solution that includes an extended heatsink, MOSFET thermal pads rated for 7W/mK, additional choke thermal pads, and M.2 Shield Frozr technology. These features help dissipate heat efficiently, ensuring that the system remains cool even during extended gaming or high-performance tasks. Additionally, the motherboard includes built-in WiFi capabilities, allowing for seamless wireless connectivity without the need for additional adapters.
The package includes the Intel Core i3-12100F processor and the MSI PRO B760-P WiFi DDR4 ProSeries motherboard. The item package dimensions are 10.469L x 10.30W x 6.72H inches, and it weighs approximately 1.49 pounds. The package contains one unit of the product.
Brand: Intel
Model: Core i3-12100F
Specifications: 4 cores, 8 threads, up to 4.3 GHz turbo frequency, LGA1700 socket, 58W TDP
Features: Supports 12th/13th Gen Intel Core processors, DDR4 memory support, enhanced power design with 12+1 duet rail power system, premium thermal solution with extended heatsink and MOSFET thermal pads
The MSI PRO B760-P WiFi DDR4 ProSeries Motherboard is designed to complement the Intel Core i3-12100F processor. It features an LGA 1700 socket, making it compatible with the latest Intel processors. The motherboard supports DDR4 memory with dual-channel support, allowing for faster data transfer rates and improved system performance. It includes a 12+1 duet rail power system with P-PAK technology, ensuring stable power delivery to the CPU for optimal performance. The motherboard also includes features like Core Boost and Memory Boost, which enhance CPU and memory performance respectively.
The motherboard is equipped with a premium thermal solution that includes an extended heatsink, MOSFET thermal pads rated for 7W/mK, additional choke thermal pads, and M.2 Shield Frozr technology. These features help dissipate heat efficiently, ensuring that the system remains cool even during extended gaming or high-performance tasks. Additionally, the motherboard includes built-in WiFi capabilities, allowing for seamless wireless connectivity without the need for additional adapters.
The package includes the Intel Core i3-12100F processor and the MSI PRO B760-P WiFi DDR4 ProSeries motherboard. The item package dimensions are 10.469L x 10.30W x 6.72H inches, and it weighs approximately 1.49 pounds. The package contains one unit of the product.
Brand: Intel
Model: Core i3-12100F
Specifications: 4 cores, 8 threads, up to 4.3 GHz turbo frequency, LGA1700 socket, 58W TDP
Features: Supports 12th/13th Gen Intel Core processors, DDR4 memory support, enhanced power design with 12+1 duet rail power system, premium thermal solution with extended heatsink and MOSFET thermal pads
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