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GIGABYTE X670E AORUS Master Gaming Motherboards - DDR5, PCIe 5.0, Wi-Fi 6E
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| Brand: | GIGABYTE |
The GIGABYTE X670E AORUS Master is a high-performance motherboard designed for AMD Ryzen 7000 Series processors, featuring the latest AM5 socket (LGA 1718). It is built for gamers and power users who demand top-tier performance, advanced connectivity, and robust thermal management. The motherboard supports DDR5 memory, offering faster data transfer rates and improved efficiency compared to previous generations. With a 16+2+2 phase digital VRM solution and an 8-layer 2X copper PCB, it ensures stable and efficient power delivery to the CPU, even under heavy workloads.
The X670E AORUS Master is equipped with cutting-edge thermal solutions, including Fins-Array III technology and M.2 Thermal Guard III, which help dissipate heat from the M.2 slots and VRM components. The NanoCarbon aluminum backplate and aluminum I/O cover add durability and enhance heat dissipation. This motherboard also features a quad M.2 slot design with PCIe 5.0 support, allowing for ultra-fast storage options such as NVMe SSDs.
Connectivity is a strong point of this motherboard, with dual USB-C ports supporting USB 3.2 Gen2x2 for high-speed data transfer, Intel WiFi 6E for faster wireless connectivity, and Intel 2.5GbE LAN for high-speed wired networking. Bluetooth 5.3 is also included for seamless wireless device pairing.
The motherboard includes advanced audio features like DTS:X Ultra and the ALC1220 CODEC for immersive sound quality. For customization and control, it offers RGB FUSION support for addressable LED strips and RGB LEDs, Smart Fan 6 for precise temperature control, and a multi-key that allows users to reset the system, switch RGB settings, access BIOS directly, or boot into safe mode. The Q-Flash Plus feature enables users to update the BIOS without installing the CPU, memory, or GPU.
The X670E AORUS Master is backed by a 5-year warranty from GIGABYTE, ensuring long-term reliability and support.
Brand: GIGABYTE
Model: X670E AORUS Master
Specifications: AM5 (LGA 1718) socket; DDR5 memory support; PCIe 5.0; Quad M.2 slots; Intel WiFi 6E; Intel 2.5GbE LAN; USB 3.2 Gen2x2 Type-C; BT 5.3; DTS:X Ultra audio; RGB FUSION; Smart Fan 6; Q-Flash Plus
Features: Direct 16+2+2 phase digital VRM; 8-layer 2X copper PCB; Fins-Array III thermal design; M.2 Thermal Guard III; NanoCarbon aluminum backplate; Aluminum I/O cover; EZ-Latch Plus with quick release/screwless design; Dual USB-C ports; Dynamic Audio with ALC1220 CODEC; Multi-key for reset/RGB switch/direct BIOS/safe mode
The X670E AORUS Master is equipped with cutting-edge thermal solutions, including Fins-Array III technology and M.2 Thermal Guard III, which help dissipate heat from the M.2 slots and VRM components. The NanoCarbon aluminum backplate and aluminum I/O cover add durability and enhance heat dissipation. This motherboard also features a quad M.2 slot design with PCIe 5.0 support, allowing for ultra-fast storage options such as NVMe SSDs.
Connectivity is a strong point of this motherboard, with dual USB-C ports supporting USB 3.2 Gen2x2 for high-speed data transfer, Intel WiFi 6E for faster wireless connectivity, and Intel 2.5GbE LAN for high-speed wired networking. Bluetooth 5.3 is also included for seamless wireless device pairing.
The motherboard includes advanced audio features like DTS:X Ultra and the ALC1220 CODEC for immersive sound quality. For customization and control, it offers RGB FUSION support for addressable LED strips and RGB LEDs, Smart Fan 6 for precise temperature control, and a multi-key that allows users to reset the system, switch RGB settings, access BIOS directly, or boot into safe mode. The Q-Flash Plus feature enables users to update the BIOS without installing the CPU, memory, or GPU.
The X670E AORUS Master is backed by a 5-year warranty from GIGABYTE, ensuring long-term reliability and support.
Brand: GIGABYTE
Model: X670E AORUS Master
Specifications: AM5 (LGA 1718) socket; DDR5 memory support; PCIe 5.0; Quad M.2 slots; Intel WiFi 6E; Intel 2.5GbE LAN; USB 3.2 Gen2x2 Type-C; BT 5.3; DTS:X Ultra audio; RGB FUSION; Smart Fan 6; Q-Flash Plus
Features: Direct 16+2+2 phase digital VRM; 8-layer 2X copper PCB; Fins-Array III thermal design; M.2 Thermal Guard III; NanoCarbon aluminum backplate; Aluminum I/O cover; EZ-Latch Plus with quick release/screwless design; Dual USB-C ports; Dynamic Audio with ALC1220 CODEC; Multi-key for reset/RGB switch/direct BIOS/safe mode
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