This product is a cooling solution designed for small electronic components, particularly VRMs, MOSFETs, and IC chips on motherboards and other compact devices. It includes 100 mini heatsinks made of black anodized aluminum, which are ideal for passive cooling in tight spaces. The heatsinks are small enough to fit within standard cases and are suitable for use in motherboards, 3D printers, miners, and similar equipment. The included thermal conductive adhesive silicone glue ensures secure and efficient heat transfer between the heatsink and the component being cooled.
The heatsinks measure 9mm x 9mm x 5mm and weigh approximately 0.58 grams each. This compact size makes them suitable for components with limited space for larger cooling solutions. The thermal adhesive is designed to provide good conductivity while maintaining flexibility and durability under various operating conditions. The black anodized finish not only enhances the appearance but also offers protection against corrosion and wear.
The package includes everything needed for immediate use: 100 heatsinks and 10 grams of thermal adhesive. No additional tools or materials are required to apply the heatsinks to your components. The adhesive is easy to apply and can be used on a variety of surfaces, ensuring a secure bond that helps maintain optimal temperatures during operation. This makes the kit a convenient option for both DIY enthusiasts and professionals working on compact electronics.
The product is best suited for users who need to cool small electronic components without the need for active cooling solutions like fans. It is particularly useful in environments where space is limited, such as in mini-ITX motherboards or embedded systems. However, it may not be effective for high-power components that generate significant heat, as passive cooling has limitations compared to active cooling methods.
Brand: Easycargo
Model: VRM Heatsink Kit
Specifications: 100pcs 9mmx9mmx5mm black anodized aluminum heatsinks + 10g thermal adhesive
Features: Passive cooling, compact design, thermal conductive adhesive, suitable for VRM, MOSFET, GPU, IC chips
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