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LGA 4677 Alphacool ES Jet 2U CPU Cooler

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Brand: Alphacool

The Alphacool ES Jet 2U CPU Cooler is designed for high-performance Intel processors using the LGA 4677 socket, commonly found in server and workstation environments. It features a unique four-nozzle water distribution system that ensures even cooling across all processor cores. This design allows for efficient heat dissipation of up to 800 watts, making it ideal for systems with intense thermal demands. The cooler is built with nickel-plated copper, which provides excellent thermal conductivity and durability in demanding environments.

The four nozzles are integrated into the cooler floor and are not milled, ensuring a smooth water flow that enhances cooling efficiency. The compact and flat design allows for easy installation in server racks, with connections placed on the top to save space. This makes it suitable for environments where space is limited but cooling performance is critical. The materials used, including nickel-plated copper and acetal, ensure both durability and effective heat transfer.

The included thermal paste, Alphacool Subzero, has a thermal conductivity of 16 W/mK and is electrically non-conductive. It is suitable for high contact pressures and can be applied effectively despite its high viscosity. The cooler is compatible with Intel LGA 4677 sockets and optionally with AMD SP5 LGA 6096. This versatility makes it a good choice for both Intel and AMD systems that require advanced cooling solutions.

The dimensions of the cooler are 118.50 x 75.50 x 23.50mm, making it compact while still providing a large radiator surface area. The design ensures optimal cooling without taking up excessive space in the server or workstation chassis. The use of G1/4" connections allows for easy integration into existing liquid cooling loops.

Brand: Alphacool
Model: ES Jet 2U
Specifications: LGA 4677, 4 nozzles, 800W heat dissipation, nickel-plated copper, G1/4" connections, 118.50 x 75.50 x 23.50mm
Features: Four-nozzle water distribution, compact design, high thermal conductivity materials, compatible with Intel LGA 4677 and AMD SP5 LGA 6096
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