Copper Pad Shim Thermal Kit for PS3, 3D Printer, CPU GPU - 4pcs 40mm x 40mm x 0.5mm Easycargo

This product is a thermal pad shim kit designed for cooling applications in various electronic devices. It includes four copper pads with precise dimensions, making them suitable for use in devices like the Sony Playstation 3, 3D printers, and thermoelectric modules. The copper material ensures efficient heat transfer, which is essential for maintaining optimal performance and longevity of the components. These shims are ideal for filling small gaps between heat sinks and components to improve thermal conductivity.

The copper pads have a high thermal conductivity of 401 W/mK, which allows for effective heat dissipation. This makes them particularly useful in applications where precise temperature control is necessary, such as in CPUs, GPUs, and Peltier modules. The thin profile of 0.5mm ensures that they can fit into tight spaces without adding unnecessary bulk. Their low profile design also makes them compatible with a wide range of devices that require compact cooling solutions.

Each copper pad measures 40mm x 40mm x 0.5mm, providing a consistent and reliable fit for most standard cooling setups. The material used is pure copper, known for its excellent thermal properties and durability. These pads are easy to handle and install, making them a practical choice for both DIY enthusiasts and professionals working on thermal management systems.

The kit comes with four pieces, which is sufficient for multiple applications or replacements. They are lightweight, weighing only 7 grams each, which makes them easy to store and transport. The included copper shims are versatile and can be used in various cooling scenarios, from personal computing devices to industrial equipment. Their compatibility with a wide range of devices ensures that they can be used in different cooling setups.

Brand: Easycargo
Model: 4pcs 40mm Copper Pad Shim Thermal Kit
Specifications: 40mm x 40mm x 0.5mm, 401 W/mK thermal conductivity, 7 grams per piece
Features: High thermal conductivity, low profile design, compatible with PS3, 3D printers, Peltier modules, and more