The Copper MC-200 Heatsink is designed for efficient cooling of electronic components such as DDR memory, VGA cards, and other IC chips. It is made from pure copper, which provides excellent thermal conductivity and ensures that heat is dissipated effectively. The compact size of 22 x 8 x 5mm makes it suitable for tight spaces where larger cooling solutions are not feasible. Its lightweight design also makes it easy to handle and install without adding unnecessary bulk to the system.
The heatsink features a groove design that enhances heat dissipation by increasing the surface area in contact with the component. This helps in reducing temperatures in enclosed environments, which is crucial for maintaining the performance and longevity of sensitive electronics. The self-adhesive backing allows for quick and secure installation without the need for additional tools or adhesives. This makes it ideal for users who want to upgrade their cooling without complicated setups.
Each package includes eight pieces of the MC-200 heatsink, providing enough units for multiple components or replacements. The versatility of this product allows it to be used on a variety of devices including motherboards, graphics cards, and other electronic components that generate heat during operation. It is particularly useful in scenarios where overheating could lead to system instability or hardware failure.
The product is compatible with a wide range of electronic components that require efficient cooling solutions. However, due to its small size, it may not be suitable for high-power components that generate significant heat. Users should ensure that the surface they are applying the heatsink to is clean and flat for optimal adhesion and performance.
Brand: uxcell
Model: MC-200
Specifications: 22mm x 8mm x 5mm, 8 pieces per package, pure copper material
Features: Self-adhesive, compact size, efficient heat dissipation, groove design
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