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Copper Heatsink Set with 3M 8810 Thermal Tape, 10pcs 10x10x4mm for VRM IC Cooling

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Brand: Easycargo

This product is a set of copper heatsinks designed for cooling VRM IC chips, commonly used in computer hardware. Each heatsink is small in size, making it suitable for compact and standard-sized cases. The set includes 10 pieces of 10x10x4mm copper heatsinks with pre-applied 3M 8810 thermal conductive adhesive tape, which ensures efficient heat transfer and easy installation. The copper material provides high thermal conductivity, helping to dissipate heat effectively from sensitive components.

The heatsinks are made from C1100 copper alloy, known for its durability and excellent heat dissipation properties. The vertical and horizontal grooves on the surface increase the surface area, enhancing cooling efficiency. The pre-applied thermal tape has a thermal conductivity of 0.60 W/m-K, ensuring good contact between the heatsink and the VRM IC. This setup minimizes the need for additional thermal paste or complicated installation steps.

Each heatsink measures 10mm x 10mm x 4mm and weighs approximately 2 grams. The compact size allows for easy placement in tight spaces without interfering with other components. The set includes four pieces of heatsinks with the adhesive tape already applied, making it a convenient solution for users looking to upgrade their cooling system without extra preparation. The RoHS compliance ensures that the product meets environmental and safety standards.

The kit is ideal for users who need to cool VRM ICs in motherboards or other electronic devices. It is particularly useful for enthusiasts or professionals who want to improve thermal performance without significant modifications. The pre-applied tape simplifies the installation process, reducing the risk of improper application that could lead to poor heat transfer.

Brand: Easycargo
Model: 101004C04-3M-8810
Specifications: 10mm x 10mm x 4mm, C1100 copper, 3M 8810 thermal tape, RoHS compliant
Features: Pre-applied thermal tape, high thermal conductivity, compact design, durable structure
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