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Copper Heatsink Pad with Thermal Tape for Laptop RAM DDR5 DDR4 DDR3 SODIMM - Easycargo
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| Brand: | Easycargo |
Low profile copper heatsink for cooling laptops and notebooks memory RAM. This product is designed to help manage heat from SODIMM memory modules, preventing overheating and performance throttling. It is suitable for DDR5, DDR4, and DDR3 memory types, making it versatile for various laptop and desktop systems. The heatsink is built specifically for the physical layout of SO-DIMM RAM, ensuring a secure fit without interfering with other components.
The heatsink is made from C1100 copper alloy, known for its high thermal conductivity of 401W/mK. This material ensures efficient heat dissipation while maintaining a lightweight and durable structure. The design includes a pre-applied 3M 8810 thermal conductive adhesive tape, which simplifies installation and ensures optimal thermal contact between the heatsink and the memory module. The tape has a thermal conductivity of 0.60 W/m-K, enhancing the overall cooling performance.
Each package includes two pieces of the heatsink, allowing users to install one on each memory module for balanced cooling. The dimensions are compact at 63mm x 23mm x 0.5mm, making it suitable for use in laptops and notebooks with limited space. The product is RoHS compliant, ensuring it meets environmental and safety standards. It is compatible with both laptop and desktop systems that use SODIMM RAM modules.
This heatsink is ideal for users looking to improve the thermal management of their laptop or desktop memory modules. It is particularly useful for gamers, content creators, and professionals who rely on high-performance computing without the risk of overheating. The low profile design ensures it fits within tight spaces without affecting other components or airflow.
Brand: Easycargo
Model: 6323-05C02-8810
Specifications: C1100 Copper, 401W/mK Thermal Conductivity, 63mm x 23mm x 0.5mm Dimensions, 3M 8810 Thermal Tape
Features: Pre-applied Thermal Tape, Low Profile Design, Compatible with DDR5/DDR4/DDR3 SODIMM, RoHS Compliant
The heatsink is made from C1100 copper alloy, known for its high thermal conductivity of 401W/mK. This material ensures efficient heat dissipation while maintaining a lightweight and durable structure. The design includes a pre-applied 3M 8810 thermal conductive adhesive tape, which simplifies installation and ensures optimal thermal contact between the heatsink and the memory module. The tape has a thermal conductivity of 0.60 W/m-K, enhancing the overall cooling performance.
Each package includes two pieces of the heatsink, allowing users to install one on each memory module for balanced cooling. The dimensions are compact at 63mm x 23mm x 0.5mm, making it suitable for use in laptops and notebooks with limited space. The product is RoHS compliant, ensuring it meets environmental and safety standards. It is compatible with both laptop and desktop systems that use SODIMM RAM modules.
This heatsink is ideal for users looking to improve the thermal management of their laptop or desktop memory modules. It is particularly useful for gamers, content creators, and professionals who rely on high-performance computing without the risk of overheating. The low profile design ensures it fits within tight spaces without affecting other components or airflow.
Brand: Easycargo
Model: 6323-05C02-8810
Specifications: C1100 Copper, 401W/mK Thermal Conductivity, 63mm x 23mm x 0.5mm Dimensions, 3M 8810 Thermal Tape
Features: Pre-applied Thermal Tape, Low Profile Design, Compatible with DDR5/DDR4/DDR3 SODIMM, RoHS Compliant
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