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Copper GPU Water Cooling Block with Metal Backplate for ASUS TUF RTX4090 A02 and RTX4070TIS Graphics Cards

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Brand: Barrow

Copper GPU water cooling block designed for specific ASUS TUF RTX4090 A02 and RTX4070TIS graphics cards. It features a metal backplate that provides structural support and protection to the GPU and its components. The cooling block is built with high-quality materials to ensure efficient heat dissipation and long-term durability. It is ideal for users looking to enhance the thermal performance of their high-end graphics cards.

The cooling block uses a three-layer cold finger core design with a 10mm thick copper base. This design allows for better heat absorption and distribution across the GPU core. The microchannel structure increases the contact area between the coolant and the soleplate, improving overall cooling efficiency. The copper material ensures excellent thermal conductivity, while the nickel plating prevents oxidation and extends the lifespan of the component.

The backplate is designed to cover most of the GPU PCB, offering protection to the video memory and other sensitive components. Its size is optimized to leave more internal space in the chassis for other hardware. The block includes a G1/4" thread for compatibility with standard water cooling systems. It is recommended to check the PCB layout of the graphics card before installation to ensure proper fit.

Installation requires careful attention to detail, including proper placement of thermal paste and alignment of the water block inlet and outlet. The product does not include English instructions, so users may need to rely on visual guides or technical support. The use of alcohol-based coolants is prohibited, as it can damage the components. Users should be aware that compatibility issues or damage due to improper installation are not eligible for returns.

Brand: Barrow
Model: BS-AST4090OG-PA
Specifications: Red Copper + Acrylic, G1/4" Thread, 10mm Thick Copper Base, Microchannel Cooling Design
Features: Three-Layer Cold Finger Core, Nickel-Plated Soleplate, Metal Backplate, High-Density Jet Microchannel
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